Self-contained liquid cooling: the low-friction option

Each new generation of server silicon is pushing traditional data center air cooling closer to its operational limits. In 2025, the thermal design power (TDP) of top-bin CPUs reached 500 W, and server chip product roadmaps indicate further escalation in pursuit of higher performance. To handle these high-powered chips, more IT organizations are considering direct liquid cooling (DLC) for their servers. However, large-scale deployment of DLC with supporting facility water infrastructure can be costly and complex to operate, and is still hindered by a lack of standards (see DLC shows promise, but challenges persist).

In these circumstances, an alternative approach has emerged: air-cooled servers with internal DLC systems. Referred to by vendors as either air-assisted liquid cooling (AALC) or liquid-assisted air cooling (LAAC), these systems do not require coolant distribution units or facility water infrastructure for heat rejection. This means that they can be deployed in smaller, piecemeal installations.